Building FPCB is a complex multi-step process.
Each critical step carries a risk of defect. The coverlay lamination process fully encapsulates the delicate structure of FPCB, giving protection and insulation.
Versiv Release Fabrics play a critical role in this process, helping to reduce defect rates, thereby increasing production yield for all types of vacuum, quick sheet and roll-to-roll lamination processes.
For all flex circuit types, Versiv productivity aids are an effective barrier layer in blocking contaminants, as well as providing a release layer, which ensures clean and easy separation of all types of protective release film from the defect-free FPCB after compression.